Project description
Pushing the limits of chip miniaturisation down to 1.4 nm
Microchips constantly evolve to meet requirements for more powerful computing systems. The EU-funded 14ACMOS project aims to develop solutions for the 1.4 nm process technology node. Project activities address four key pillars: lithography, metrology, mask-infrastructure and process technology. Lithography solutions will be pushed to meet 1.4 nm capability, and extreme UV plasma physics will be studied to optimise optics transmission and lifetime. In the metrology pillar, advanced methods will be developed to improve measurement sensitivity and uncertainty and assess reticle degradation introduced by extreme UV light. Mask-infrastructure will cover the development of mask repair strategies based on particle removal technology, and assess durability. Process technology involves the development of patterning solutions, active device selection and new interconnect technology, which are suitable for the 1.4 nm technology node.
Objective
14ACMOS is about enabling manufacture of 14A Semiconductor technology. It addresses the 4 key pillars in IC technology development for manufacture; Lithography, Metrology, Mask Infrastructure and Process technology.
Carl ZEISS, Trumpf and ASML are the main parties to push the lithography solutions to 14A. Between Carl ZEISS, Fraunhofer, RWTH, UW and TNO further understanding of optics life time and plasma physics is pursued in optimizing optics transmission and lifetime.
Nova, BRT, ILT and PTB address measurement sensitivity enhancement of X-ray and optical based methodologies to meet the 14A requirements. Imec, TNO, PTB, UPB and RWTH will combine and tune metrology techniques specifically for the assessment of EUV reticle degradation. On throughput and resolution enhancement Bruker, EXC, PTB and AMIL will work on X-ray sources and AMIL, ICT and NFI on e-beam and SPM platforms for in-line metrology. On the reduction of Total Measurement Uncertainty, Prodrive and AMIL cover the development of an ultra-high precision wafer stage and NVIDIA, AMIL and Prodrive the development of a next generation image processing system.
In Mask Infrastructure there are FHG (IISB), ASML, Carl Zeiss covering the creation of a simulation based mask repair strategy and with Carl ZEISS, ASML, PI and UPB HW/SW and process technology for particle removal is created and repair durability is covered with Carl ZEISS, ASML, Suss and UPB.
Process technology covers the creation of patterning solutions with the involvement of imec and TEL. On active device selection there will be imec, Cadence, IBS, JSR, Recif and TEL with THERMO enabling advanced TEM characterization. Middle Of Line and Back End Of Line solution development is with imec, TEL, Solmates and Coventor for process modules and Cadence the interface with the design community. On Sustainable Semiconductor Technology and Systems there are imec, Recif and ThermoFisher covering sustainable material and processing alternatives.
Fields of science
Keywords
Programme(s)
Funding Scheme
HORIZON-JU-IA - HORIZON JU Innovation ActionsCoordinator
5504DR Veldhoven
Netherlands
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Participants (23)
76705 Rehovot
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2306990 Migdal Haemek
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1170 Bruxelles / Brussel
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73447 Oberkochen
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164 40 Kista
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
13790 Rousset
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
3001 Leuven
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3001 Leuven
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23100 Migdal Haemek
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3047 AT Rotterdam
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
76100 REHOVOT
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76228 Karlsruhe
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5692 EM Son En Breugel
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38116 Braunschweig
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31700 Blagnac
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
7521 PE Enschede
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75447 Sternenfels
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5651 GG Eindhoven
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2595 DA Den Haag
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71254 Ditzingen
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060042 Bucharest
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7522 NB Enschede
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91140 Villebon Sur Yvette
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
Partners (1)
RH10 9QL Crawley
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